13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer Cincoze DV-1100
Price and avalability
Partnumber | Description | Price VAT incl | Avalability |
---|---|---|---|
DV-1100-R10 | Високопродуктивний компактний комп'ютер Cincoze DV-1100 12/13th Generation Intel Core Series Processors, High Performance and Essential Rugged Embedded Computer | 55 870,2 | Доступно |
The DV-1100 is a compact, high-performance, embedded edge computer that supports 13th/12th generation Intel® processors. Its balance between high-performance computing needs and cost-effectiveness enables enterprises to quickly analyze and process edge data for better decision-making and improved production efficiency and accuracy. The DV-1100 is ideal for smart manufacturing, machine vision, railway computing, and space-constrained applications where stability and reliability are paramount.
- Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Wide operating temperature -40°C to 70°C
Additional information
System |
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Processor |
• 13th Generation Intel® Raptor Lake-S Series CPU: - Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W - Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W - Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W - Intel® Core™ i5-13400E 10 Cores Up to 4.6 GHz, TDP 65W - Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W - Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W - Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W - Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W - Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W • 12th Generation Intel® Alder Lake-S Series CPU: - Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W - Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W - Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W - Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W - Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W - Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W - Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W - Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W - Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W - Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W - Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W - Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W |
Chipset | Intel H610E Chipset |
Memory | 1x DDR5 4800Mhz SO-DIMM Socket Supports Un-buered and non-ECC Type, Up to 32GB |
BIOS | AMI BIOS |
Graphics |
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Graphics Engine |
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Maximum Display Output | Supports Triple Independent Display |
DP | 1x DisplayPort Connector: 3840 x 2160 @60Hz |
VGA | 1x VGA Connector: 1920 x 1200 @60Hz |
CMI Display | 1x CMI Interface for Optional CMI-DP/CMI-HDMI Module Expansion |
Audio |
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Audio Codec | Realtek® ALC888, High Definition Audio |
Line-out | 1x Line-out, Phone Jack 3.5mm |
Mic-in | 1x Mic-in, Phone Jack 3.5mm |
I/O |
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LAN |
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COM | 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 |
USB |
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Storage |
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SSD/HDD | 1x 2.5" SATA HDD/SSD Bay (SATA 3.0) |
M.2 SSD |
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Expansion |
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M.2 Key E Socket | 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless/Intel CNVi Module Expansion |
M.2 Key B Socket |
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SIM Socket | 1 x Front Accessible Dual Nano SIM Socket |
CMI (Combined Multiple I/O) Interface |
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CFM (Control Function Module) Interface | 1x CFM IGN Interface for optional CFM-IGN Module Expansion |
Power |
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Power Button | 1x ATX Power On/Off Button |
Power Mode Switch | 1x AT/ATX Mode Switch |
Power Input | 9 - 48VDC, 3-pin Terminal Block |
Remote Power On/Off | 1x Remote Power On/Off, 2-pin Terminal Block |
Remote Power LED | 1x Remote Power LED, 2-pin Terminal Block |
Physical |
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Dimension ( W x D x H ) | 224.1 x 162 x 62 mm |
Weight Information | 2.52 KG |
Mechanical Construction | Extruded Aluminum with Heavy Duty Metal |
Mounting | Wall / DIN-RAIL / VESA Mount |
Physical Design |
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Operating System |
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Windows | Windows®11, Windows®10 |
Linux | Ubuntu 22.04 |
Environment |
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Operating Temperature |
35W TDP Processor: -40°C to 70°C 65W TDP Processor: -40°C to 55°C (With External Fan Kit) * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
Storage Temperature | -40°C to 70°C |
Relative Humidity | 95% RH @ 70°C (Non-condensing) |
Shock | MIL-STD-810H |
Vibration | MIL-STD-810H |
EMC |
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EMI |
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EMS |
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